The following are some of the problems and reasons that may occur during the edge banding process.

Problem: The edge banding can be easily torn off by hand, and the hot melt adhesive remains on the panel. You can see the grid pattern of the glue roller. Possible causes/hints: Not enough adhesive has been applied. The room temperature is too low. The edge banding material is too cold. The hot melt temperature is too low. The feed rate is too low. The pressure applied by the coating roller is too small.

Problem: The edge banding can be easily torn off by hand, and the hot melt adhesive remains on the panel. The surface of the hot melt adhesive is completely smooth (sealing edges fall off). Possible cause/reminder: The board and/or edge banding are too cold. Check the type of hot melt adhesive. Check the application of the adhesive.

Problem: Most of the hot melt adhesive remains on the edge banding. Possible cause/reminder: Due to previous processing (ie veneer), the temperature of the board is too high.

Problem: The glue joint is not closed (edge ​​banding machine). Possible cause/hint: The pressure applied is too small. The adhesive is too cold. The edge bands are not pre-tensioned or reverse pre-tensioned. It may be necessary to increase the application temperature, preheat the circuit board, or increase the feed rate.

Problem: The glue joint is not closed (processing center). Possible cause/hint: The pressure applied is too small. The edge banding is too cold to be squeezed. The resilience of the edge banding material is too high. Increase heater power or decrease feed rate. Add geometric shapes or use thinner edges. The adhesive is not suitable for the center of the machine or the thermal adhesion is too low.

Problem: The edge bands are only glued at the edges. Possible cause/hint: The pressure applied is too small. The milled joints on the board are hollow. The edge pre-tightening force is too high.

Problem: The glue sealing edge band on the front of the board is not fully bonded, or the glue roller is not aligned, which causes the edge band to crack on the front. Possible causes/hints: Insufficient glue application due to misalignment of the glue rollers; apply more adhesive.

Problem: Milling waves are visible. Possible causes/hints: The feed rate is too high. The speed of the cutting machine is too low. Reprocess with spatula and polishing; cut to feed. Increase the number of tools on the router bit. Increase the speed.

Problem: On thick edge banding, the color of the milled area will fade slightly (stress whitening). Possible causes/hints: Use a hot air station (can be retrofitted) to heat the milling area. The scraper blade is too thick. Rework on the polishing station. Reduce scraper chip thickness (maximum 0.1 – 0.2 mm).

Problem: There are signs of stress whitening in the radius during machining of the machine center. Possible cause/reminder: The edge banding strip is fed too cold. Increase heater power or decrease feed rate. Add geometric shapes or use thinner edge banding materials.

Problem: The adhesive is sticky after use. Possible causes/hints: Reduce application temperature. Clean the adhesive part. Use different adhesives for testing.

Problem: There are so-called "rat teeth" in the joints. Possible cause/hint: Apply more adhesive. Increase application temperature. Preheat the circuit board.

Problem: The longitudinal edges are broken after cross-sealing. Possible reasons/hints: Only format the MDF board and use it. Check the immersion depth of the router. Reduce material removal or use different panels.

Problem: "Indentation" or "scratch" in the edge band. Possible causes/hints: Clean the edge banding. Clean the pressure rollers and spray them with release agent. Clean the scan head; if this does not help, check the scan head for damage and replace if necessary.

Problem: The sealing edge is damaged or stained. Possible cause/hint: Sharpen the cross-cut saw. Ask the tool manufacturer for suitable tools.

Problem: There are breakthroughs on the top and bottom edges. Possible reasons/hints: Reduce the overhang of the sealing edge. One day before processing (over 18C), adapt to edge banding and cardboard. Increase the room temperature and prevent ventilation.

Problem: The edge band is smudged when copying. Possible causes/hints: Reduce the number of blades. Control the speed. The edge is milled against the feed material. Increase the feed rate. Source: Surteco Canada Ltd., Brand: Doellken. For information, please call 800-461-0061 or visit na.doellken.com.

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